By Gordon Roberts, Friedrich Taenzler, Mark Burns
Built-in circuits incorporating either electronic and analog capabilities became more and more usual within the semiconductor undefined. Mixed-signal IC attempt and dimension has grown right into a hugely really good box of electric engineering. besides the fact that, try out engineering continues to be a comparatively unknown occupation in comparison to IC layout engineering.
Read or Download An Introduction to Mixed-Signal Test and Measurement PDF
Best circuits books
MCMs this present day include complicated and dense VLSI units fixed into programs that permit little actual entry to inner nodes. The complexity and price linked to their try out and analysis are significant stumbling blocks to their use. Multi-Chip Module try concepts provides cutting-edge try recommendations for MCMs.
This e-book bargains complete assurance of the optimal layout of a variety of fiber optic platforms. the writer avoids advanced arithmetic and derivations, yet bargains the equations essential to eloquently describe fiber optic elements and structures. clarity is greater via first-class figures, diagrams and graphs.
After approximately a decade of luck as a result of its thorough insurance, abundance of difficulties and examples, and sensible use of simulation and layout, Power-Switching Converters enters its moment variation with new and up to date fabric, solely new layout case stories, and elevated figures, equations, and homework difficulties.
With the evolution of semiconductor expertise and international diversification of the semiconductor enterprise, trying out of semiconductor units to platforms for electrostatic discharge (ESD) and electric overstress (EOS) has elevated in value. ESD trying out: From parts to platforms updates the reader within the new assessments, attempt types, and methods within the characterization of semiconductor elements for ESD, EOS, and latchup.
Additional resources for An Introduction to Mixed-Signal Test and Measurement
These requirements include board thickness, connector locations, DUT socket mechanical holes, and various alignment pins and holes. Handlersand probersmust makea reliable electricalconnectionbetweenthe DUT andthe tester. Unfortunately,the metallic contactsbetween DUT and DIB board are often very inductiveand/orcapacitive. Stray inductanceand capacitanceof the contactscan representa major problem,especiallywhen testinghigh-impedanceor high-frequencycircuits. Although Chapter 1 . Overview of Mixed-Signal Testing 19 severalcompanieshave marketed test sockets that reduce these problems, a socketed device will often not perform quite as well as a device soldered directly to a printed circuit board.
3 Electromechanical Fixturing Challenges The test head and DlB board must ultimately make contact to the DUT through the handler or prober. There are few mechanical standardsin the ATE industry to specify how a tester should be docked to a handler or prober. The test engineer has to design a DlB board that not only meets electrical requirements, but also meets the mechanical docking requirements. These requirements include board thickness, connector locations, DUT socket mechanical holes, and various alignment pins and holes.
This test cost includes tester depreciation, handler depreciation, electricity, floor space, personnel, etc. 5 s, assuming 5 million devices per year are to be shipped. 5 s. 19. , for each $1 worth of devices shipped to the customer, the company makes a profit of 20 cents). 18? 80, how many devices does this represent? What obvious conclusion can we draw about the importance of test time reduction versus the importance of selling and shipping additional devices? References 1. , Boston,MA 02118 2.
- Penicillin - A Medical Dictionary, Bibliography, and by Icon Health Publications
- The Literature of Labor and the Labors of Literature: by Cindy Weinstein